SGC45 Silicon Ingot Cutting Equipment - Shine Smart Equip

Technical Specification

SGC45 Silicon Ingot Cutting Machine
	Parameter	Value or Specification
1	Maximum Workpiece Diameter (mm)	450
2	Maximum Workpiece Length (mm)	1500
4	Worktable Y-Axis Travel (mm)	400
5	Worktable Z-Axis Travel (mm)	500
10	Maximum Diamond Wire Speed (m/s)	36 (Max)
13	Minimum Feed Increment X-Axis (mm)	0.01
14	Minimum Feed Increment Y-Axis (mm)	0.01
15	Repeat Positioning Accuracy X-Axis (mm)	±0.02
16	Repeat Positioning Accuracy Y-Axis (mm)	±0.02
20	Total Power Consumption (kW)	3.5
21	Power Supply (Three-phase Five-wire)	AC220V 50Hz
22	Air Supply (MPa)	0.6
23	Machine Size(mm)	200012001800
24	Machine weight(kg)	1800

This device is a diamond cutting equipment specifically designed for the semiconductor and photovoltaic industries to do Silicon Ingot Cutting . The cutting tool used is the latest closed-loop diamond wire, capable of segmenting the silicon rod and taking slices/seeds after the cutting process.

SGC45 is designed for the cutting of 18-inch silicon rods, while a similar structure, SGC30, is suitable for cutting 12-inch silicon rods.

Compared to diamond band saws and traditional single-wire cutting devices, this circular or endless diamond wire cutting equipment exhibits a lower edge chipping rate, superior cutting surface quality, and reduced material wastage.

Silicon Ingot Cutting Equipment

Pre-shipment Client Acceptance Video

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Pictures of Success Silicon Ingot Cutting

silicon ingot cutting wire saw.

Silicon Ingot Cutting Applications

Top &Tail Cut

Silicon Ingot Cutting Machine

Specifically designed to handle 18-inch diameter silicon ingots, this machine excels in the precise removal of head and tail sections of the rods.

Brigde Cutting/Cropping

Silicon Ingot Cutting Machine

This machine have 400 feed which can section the silicon rod automatically.

Seeding

Silicon Ingot Cutting Machine

One of the key applications of this machine is its ability to perform seeding on segmented silicon rods

Equipment Advantage

Specialization for Large Ingots

Specifically designed to handle 18-inch diameter, 1.5-meter-long monocrystalline silicon rods, making it ideal for processing large ingots which are common in the industry.

Precision Cropping and Seeding

Offers high-precision removal of head and tail sections and accurate segmentation of the ingot, which is crucial for high-quality wafer production

Endless Diamond Wire Technology

The use of a continuous diamond wire ensures efficient, consistent cuts with a significantly reduced risk of wire breakage compared to traditional methods

Less Edge Break and Better Cutting Surface

The diamond wire saw provides a superior cutting surface, resulting in fewer edge breaks and contributing to the overall quality of the wafers.

Reduced Material Waste

The small cutting wire minimizes kerf loss, optimizing material usage and reducing waste, which is cost-effective and environmentally friendly.

Improved Productivity

Streamlines the cropping and seeding process, facilitating quicker transition to wafer slicing, thus enhancing overall production efficiency.

Durability and Low Maintenance

Built with robust materials and designed for longevity, requiring minimal maintenance even in continuous production environments.

User-Friendly Interface

eatures an intuitive control panel for easy operation, allowing for quick setup and adjustments with minimal training.

Enhanced Safety Features

Incorporates safety measures to protect operators, including automated shut-off sensors and protective barriers.

Customer Testimonials

Industry: Semiconductor Manufacturing

Our experience with the diamond band saw has been transformative. the new silicon ingot cutting machine SGC45 cut our 18 inch silicon rod very nice. The machine's stability truely set it apart. It's been a game-changer for our production line.

Mr Liu

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Frequently Asked Questions

What is the maximum size of ingot that the machine can handle?

The machine is designed to handle ingots up to 450 mm in diameter, accommodating a wide range of sizes for different industry needs.

How does the machine ensure the consistency of wafer thickness?

With our advanced tension control system accurate to ±0.1N and a high-precision servo system, the machine maintains a consistent cutting pressure, ensuring uniform wafer thickness.

What materials can this machine cut besides silicon?

The machine is versatile enough to cut a variety of materials, including but not limited to silicon, sapphire, and certain types of glass suitable for semiconductor and photovoltaic applications.

Can the cutting speed be adjusted according to different materials?

Yes, the cutting speed can be adjusted to suit different materials and cutting requirements, providing flexibility and control over the production process.

What kind of maintenance and servicing does the machine require?

The machine is designed for easy maintenance, with a robust construction that minimizes wear and tear. Regular servicing includes checking wire tension, inspecting the servo system, and cleaning the wire path.

Is training provided for operating the machine?

Yes, we provide comprehensive training for operators to ensure they can use the machine safely and efficiently, including handling the software and understanding the mechanics.

What is the lifespan of the cutting wire, and how is it replaced?

The lifespan of the cutting wire depends on usage and the materials being cut. We provide detailed instructions for wire replacement, and the machine is designed to make this process as straightforward as possible.

Does the machine come with a warranty or after-sales support?

Absolutely, the machine comes with a manufacturer's warranty, and we offer after-sales support to address any operational issues you may encounter.

Can the machine be integrated with existing production lines?

Yes, the machine is designed to be compatible with existing production lines and can be integrated to work in tandem with other manufacturing equipment.

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